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Agilent Technologies Announces High-Frequency/High-Speed EDA Release for Integrated Circuit, Package and Board Co-Design

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Agilent Technologies Announces High-Frequency/High-Speed EDA Release for Integrated Circuit, Package and Board Co-Design

Image 1:
Advanced Design System 2009, the high-frequency/high-speed co-design release from Agilent Technologies, allows circuit, package, board, and system designers to use a single EDA platform to identify any unexpected component interactions before hardware is fabricated. Designers can share simulation models, minimizing design rework, costs, and delays.

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Related Information
  Press Release:

Agilent Technologies Announces High-Frequency/High-Speed EDA Release for Integrated Circuit, Package and Board Co-Design
(23-February-09)
  Agilent Photography Use Policy:

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